Job Description
Req. Number
26-104
Job Description
As a Microelectronic Assembler I, you will learn and perform a variety of electronic assembly operations. The bulk of these duties will be performing manual wire bonding and or die attach operations on state-of-the-art electronic assemblies and subassemblies for the Department of War. The devices we create are designed to save American lives on the battlefield and to give our troops a technological advantage over our advisories. Learn the skills needed to accurately and efficiently build these devices as an associate so that you can advance in your career at Mercury, while earning a competitive salary and great benefits.
This is a 2nd shift position – 2:00pm to 11:30pm on a 9/80 schedule. Training is 3rd shift 9:00pm to 6:30am
Job Responsibility:
You will be responsible for learning how to and become proficient in die attach and wire bonding die level components from work instructions and assembl...
26-104
Job Description
As a Microelectronic Assembler I, you will learn and perform a variety of electronic assembly operations. The bulk of these duties will be performing manual wire bonding and or die attach operations on state-of-the-art electronic assemblies and subassemblies for the Department of War. The devices we create are designed to save American lives on the battlefield and to give our troops a technological advantage over our advisories. Learn the skills needed to accurately and efficiently build these devices as an associate so that you can advance in your career at Mercury, while earning a competitive salary and great benefits.
This is a 2nd shift position – 2:00pm to 11:30pm on a 9/80 schedule. Training is 3rd shift 9:00pm to 6:30am
Job Responsibility:
You will be responsible for learning how to and become proficient in die attach and wire bonding die level components from work instructions and assembl...
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