Job Description

5 days,8.30am-6.15pm

Salary: $3500- $6000

Location: Ubi

Company background

Specializes in Semiconductor Backend Tooling including Die Attach Tools, Wire Bond Tools & Bond Test Tools

Job Responsibilities
  • Design and development of Semiconductor Tools and mechanical systems.
  • Planning, Scheduling and Costing of Tools and Mechanical Modules
  • Responsible for 3D & 2D drawings, tolerance analysis, BOM preparation.
  • Working closely with Electrical, Vision and Software Engineers.
  • Willing to work extended hours in critical phases of project execution.
Job Requirements
  • Diploma or Degree in Mechanical Engineering or related Technical disciplines.
  • Minimum 3 years of design experiences in semiconductor tooling
  • Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a defin...

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