Job Description
We are seeking a detail oriented Solder Assembler with a strong understanding of IPC (Institute of Printed Circuits) standards to join our manufacturing team. The successful candidate will be responsible for assembling printed circuit boards (PCBs) by soldering a wide variety of components, performing defect identification, and ensuring all work meets stringent quality and reliability requirements.
• Perform manual and/or selective soldering of through hole, surface mount (SMT), BGA, QFN, CSP, and other component types.
• Conduct visual inspections and use inspection tools (e.g., microscopes, AOI) to identify solder defects such as bridges, cold joints, tombstoning, insufficient wetting, and voids.
• Apply IPC A 610 (Acceptability of Electronic Assemblies), IPC J STD 001 (Soldering Materials), and IPC 2221/2222 (Design standards) throughout the assembly process.
• Verify that solder paste, flux, and materials meet required specifications.
• Perform manual and/or selective soldering of through hole, surface mount (SMT), BGA, QFN, CSP, and other component types.
• Conduct visual inspections and use inspection tools (e.g., microscopes, AOI) to identify solder defects such as bridges, cold joints, tombstoning, insufficient wetting, and voids.
• Apply IPC A 610 (Acceptability of Electronic Assemblies), IPC J STD 001 (Soldering Materials), and IPC 2221/2222 (Design standards) throughout the assembly process.
• Verify that solder paste, flux, and materials meet required specifications.
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