Job Description

Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

  • Perform package and device analysis on new product qualification, assembly test failure from production.
  • Define the FA flow for each FA case.
  • Generate technical FA report and assist process engineer for root-causing of defect/s.
  • SME on equipment and maintain the FA tracking.

Qualifications

REQUIRED:

  • Bachelor Degree and/or Master in Electrical/ Electronic/Material Science/Chemistry.
  • Familiar with memory product technology and structure.
  • Familiar with semiconductor and SMT assembly process and technology.
  • Familiar with wafer fab process.
  • Understand memory product test process and methodology.
  • Skillful in performing Failure Analysis in SMT, package and device analysis failure.

SKILLS:

  • Strong technical knowledge on 3D X-ray, TDR, SEM/EDX, curve tracer analysis and CSAM.
  • Good c...

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