Job Description

Description

Photonics Assembly Process Engineer

Position Overview: We are seeking a highly motivated and detail-oriented Photonics Assembly Process Engineer to join our photonics component team, specializing on advanced manufacturing processes for telecommunications applications. You will play a key role in the development of assembly processes for photonic components and systems, such as optical transceivers and other critical devices that enable high-speed communication networks. You will collaborate with cross-functional teams to ensure the scalability, reliability, and performance of photonic products used in cutting-edge telecommunication systems.


Key Responsibilities:

  • Design, implement, and optimize assembly processes from the R&D phase through production introduction, including:Wafer-level processes (e.g., wafer bumping, bonding, thinning and singulation).Flip chip bonding for high-performance interconnects.Wire bonding for ...
  • Ready to Apply?

    Take the next step in your AI career. Submit your application to Ciena today.

    Submit Application