Job Description

Intel Corporation in Malaysia is seeking a Silicon Packaging Design Engineer to drive end-to-end substrate design, from concept through tapeout, optimizing performance, manufacturability and cost. You will collaborate with silicon and hardware teams to refine package-board interfaces and pinout, while upholding design rules and quality objectives.

The role requires 4+ years in substrate design, proficiency in Cadence APD or Mentor Xpedition, and experience with Electrical Design Analysis tools.

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