Job Description
- Experienced in MCAD-ECAD co-design with understanding of thermal and mechanical design considerations.
- Excellent working knowledge of PCB Design within Cadence Allegro PCB Design including proficiency using Constraint Manager.
- Experience with advanced PCB technology, including but not limited to HDI design (including microvias and blind/buried vias), EMI/EMC compliance, and flex and rigid-flex design.
- Strong understanding of PDN, electrical, SI/PI, and DFM/DFT/DFA design principles
- Developing schematic, layout for next generation data center product as a path finding TR activity.
- Integrate with cross-functional teams Package, PI, SI, Thermal, and Power delivery teams to optimize the next-generation product design.
- Familiar with SKILL, LISP, PERL, Python code or any scripting
- Support brings up new and existing programs for the pre-silicon including path finding and performance optimization for data center GPUs. ...
Ready to Apply?
Take the next step in your AI career. Submit your application to HCLTech today.
Submit Application