Job Description
FOL Process Development Senior Staff Engineer (Die Attach/Wire Bond)
Bayan Lepas, Penang, Malaysia – OSRAM OS Penang
- Develop or optimize DA and WB processes for new product development project to meet project cost, quality and timeline targets.
- Participate and support FOL processes tehcnology roadmap and building block activities.
- Equipment selection which meet project cost, quality and timeline target.
- Share and transfer technical know how within R&D and to Manufacturing team.
- Provide technical guidance or job coaching to junior supporting staff.
Participate in engineering sample, pre-series and ramp-up build to fulfill custoemr order.
Degree or Master in Electrical / Electronics / Mechatronics / Mechanical Engineering or equivalent.
- 2-3 years in semiconductor field.
- 2-3 years in Die Attach and Wire Bond processes.
- Process egnineering knowledge in semiconductors or LED m...
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