Job Description

onsemi is currently seeking a skilled and driven NPI Engineer – Soldering Process, Diebond and Wirebond to lead the introduction and optimization of soldering processes for new product lines in a high-tech manufacturing environment. This role is essential in ensuring robust process integration, high-yield production, and seamless transition from development to manufacturing. The position reports to the Director, New Product Engineering.

  • Leads the development and implementation of soldering, diebond and wirebond processes for new product introductions (NPI).
  • Collaborate with R&D, Process Engineering, and Manufacturing teams to ensure soldering diebond and wirebond processes meet design and reliability requirements.
  • Defines process parameters, control plans, and qualification strategies for soldering diebond and wirebondoperations.
  • Conducts DFM (Design for Manufacturability) reviews with a focus on solder/ wire joint integrity and thermal prof...

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