Job Description

I'm developing a highly compact embedded hardware module that combines secure NFC authentication and, in a higher-spec version, LTE-M + GNSS tracking.
The device must fit within a very tight mechanical envelope (~34 × 18 mm footprint, less than 4 mm total height), so experience with ultra-compact multilayer PCB design and RF coexistence is essential.
Two variants are required:
• Ultra-low-power NFC-based device (target less than 5 µA sleep current)
• NFC + BLE + LTE-M + GNSS device with 125 mAh LiPo battery
Scope includes:
Schematic finalisation
RF-aware PCB layout
Power architecture optimisation
Low-power implementation
Bring-up and validation
Manufacturing outputs (Gerbers, BOM, stack-up, etc.)
Prior modular feasibility testing has already been completed. This engagement focuses on integrated PCB implementation and optimisation.
Required experience:
Nordic nRF52 / nRF53
LTE-M / NB-IoT modules (e.g. Quectel)
GNSS integration
Low-power...

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