Job Description

Renesas Electronics Malaysia seeks an experienced Director of Semiconductor IC Packaging Assembly Engineering to lead sustaining engineering and high-volume manufacturing for advanced packaging technologies. You will oversee yield, quality, process control, and ramp readiness while partnering with Package Engineering, R&D, Quality, and OSAT partners to translate NPI into scalable production.

The ideal leader combines deep packaging expertise with data-driven decision making, cross‑functional

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