Job Description

Looking for Semiconductor Assembly DIE Attached module engineer. location: Kulim

Minimum Qualifications:

  • Bachelor's degree in Materials/Mechanical/Chemical/Electrical Engineering or related field.
  • At least 2 years hands-on experience in die attach/TCB, flipchip, or semiconductor assembly process.
  • Strong knowledge of Cu pillar/microbump metallurgy, wetting, thermomechanical behavior, and finepitch alignment.
  • Proficiency in SPC and datadriven problem solving.
  • Experience with metrology analytics. ex: Xray, warpage measurement, optical inspection (AOI), microscopy.
  • Ability to work in Class 10k-100k cleanroom with PPE.

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