DCP-Fluid Dynamics Engineering(Global)-Shenzhen

Responsibilities: 

1. Responsible for thermal requirement analysis, solution optimization, FEA simulation and verification of datacenter power module/shelf/rack new products development. 

2. Seek for cost effective and innovative cooling technologies using fan, heatsink, heat pipe, cold plate, liquid cooling, immersion cooling etc.

3. Cooperate to build prototypes, perform thermal verification tests and solve thermal test issues.

4. Draft the thermal design CBB/technical instruction and patent documents.

5. Lead the pre-study project related to thermal management by learning the industry/competitor’s technology. 

Qualifications:

1. Bachelor's degree or above in mechanical, fluid and thermal engineering.

2. Proficient in using CFD simulation tools such as FloEFD, Flotherm, 6 Sigma ET, Icepack etc. and skill of CAD tool Creo is a plus.

3. Solid knowledge on heat transfer phenomena ...