Job Description

Intel in Kulim, Malaysia, is seeking an experienced engineer to develop and optimize CUF packaging processes and equipment. The role requires onsite presence to drive the roadmap for future assembly packaging platform technologies and to ensure manufacturability across designs and materials.

The candidate should hold MSc/PhD in engineering with thermal/fluid/packaging focus or equivalent, with at least 3 years of related experience; familiarity with semiconductor assembly equipment is preferred.

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