Job Description

Key Qualifications

Over 7 years of hands-on experience in semiconductor IC or module packaging, especially on Camera Module or related processes.

Process technology knowledge in SMT and advanced IC / camera module

packaging areas

Knowledgeable in advanced process equipment such as Flip Chip, Die and Wire Bonding, Molding, Wafer Dicing, Laser Singulation, Lens Holder / Active Alignment Process & etc.

Experienced working with subcontract manufacturing partners.

High volume manufacturing, and production ramp experience.

Knowledgeable in production control processes, machine commissioning, data analysis/interpretation GR&R, Cp/Cpk and correlation analysis

Fluent in English communication, additional language skills a plus.

Demonstrated ability to perform DOE, data analysis, SPC control.

Demonstrated failure mode analysis, ro...

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