Job Description

Your Role

Key responsibilities in your new role

  • Responsible for Wire Bond Development in A project and any assigned projects with objective of ensuring the project target and scope are meeting the corporate goals.
  • To convert and set-up die bonder/ wire bonder in preparation for new evaluation/ engineering/ qualification build.
  • To perform engineering data measurement, collection and data compilation.
  • Capable to analyze the engineering data in case of abnormality.
  • To support builds from development to baseload/ramp up.
  • To provide technical support from development to baseload/ ramp up.
  • To perform other duties as assigned by superior.

Your Profile

Qualifications And Skills To Help You Succeed

  • Minimum Diploma in Mechanical/ Electronic/ Electrical Engineering.
  • 5 years working experience in semiconductor with die attach and wire bond process experience...

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