Job Description

Responsibilities

  • Responsible for Wire Bond Development in a project and any assigned projects with objective of ensuring the project target and scope are meeting the corporate goals.
  • To convert and set‑up die bonder / wire bonder in preparation for new evaluation / engineering / qualification build.
  • To perform engineering data measurement, collection and data compilation.
  • Capable to analyze the engineering data in case of abnormality.
  • To support builds from development to baseload/ramp up.
  • To provide technical support from development to baseload / ramp up.
  • To perform other duties as assigned by superior.

Qualifications and Skills

  • Minimum Diploma in Mechanical / Electronic / Electrical Engineering.
  • 5 years working experience in semiconductor with die attach and wire bond process experience preferable on Die bonder: ESEC/ASM & Wire bonder: Shinkawa/ASM.
  • C...

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