Job Description

Position Overview

The Assembly Engineering Manager leads the semiconductor back-end manufacturing engineering team responsible for wafer singulation, die attach, wire bonding, AOI and final package assembly. This role ensures high-yield, cost-effective, and reliable package manufacturing aligned with quality, safety, and delivery targets.

The position typically interfaces with Operations, Process Engineering, Quality, Equipment Engineering, Supply Chain, and external OSAT partners.

Key Responsibilities

1. Technical & Process Leadership

  • Lead assembly process development, qualification, and high-volume manufacturing support.
  • Oversee technologies such as:
  • Die attach (epoxy, eutectic, sintering)
  • Wire bonding (Cu/Au), wedge bonding
  • AOI Visual Inspection
  • Singulation (saw, laser)
  • Drive NPI-to-HVM transitions and ensure robust process control plans.
  • Implement SPC, DOE, FMEA, 8D, and root c...

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