Application / Process Engineer - Die Bond Tools

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We are seeking a highly motivated and skilled Application/Process Engineer to join our Advanced Control & Test (ACT) team. This role is instrumental in supporting the development, optimization, and deployment of advanced die bonding applications for next-generation semiconductor packaging. The successful candidate will work cross-functionally to improve software and hardware integration, conduct root cause analysis, enhance process capability, and provide hands-on support to both internal teams and customers. This position requires a strong technical background, a proactive mindset, and a passion for driv...