Job Description

Description

:
  •  The Candidate will be trained on the Cadence Integrated Circuit (IC) Package Design tool set, working with state-of-the-art complex IC packaging of electronics using highly integrated IC package co-design and multi-die chiplet methodologies.
  • Ability to understand schematic, layout, interposers, integrated components.
  • Working closely with our customers who are in the Advanced Packaging space
  • Helping customers to adopt and proliferate our packaging solutions
  • Consulting customers to understand their flow requirements and creating solutions that best meet their needs
  • Conducting technical presentations, technical training, and product demonstrations, including development of customized presentations
  • Supporting technical evaluations and benchmarks
  • Collaborating with Sales Management to identify and prioritize opportunities, and to assist in developing winning sales strategies
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