Job Description
Responsibilities
- Support process development activities for customers
- Perform in-house application test cutting and provide on-site technical support
- Handle customer claims related to abrasive products and recommend solutions
- Collaborate closely with engineers based in Japan on technical matters
- Participate in company-organized events and initiatives
- Foster strong interdepartmental collaboration and teamwork
- Build and maintain long-term relationships with customers
- Carry out additional operational tasks as assigned
- Minimum 1 year of relevant working experience, preferably in the semiconductor industry
- Knowledge or experience in dicing, grinding, or laser processes is an added advantage
- Technical expertise in blade, wheel, or laser support is an added advantage
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