Advanced Packaging Technologist

About the Team:

OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI.

Role Overview

We are seeking an experienced engineer to lead the development of advanced packaging technologies that enable next-generation, high-performance compute systems. This role sits at the intersection of chip architecture, package integration, and manufacturing scale-up, driving breakthroughs in performance, power, thermal, and reliability. The ideal candida...