Job Description
Advanced Packaging Development Engineer, Quantum AI
_corporate_fare_ Google _place_ Goleta, CA, USA
**Mid**
Experience driving progress, solving problems, and mentoring more junior team members; deeper expertise and applied knowledge within relevant area.
**Minimum qualifications:**
+ Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
+ 3 years of experience developing advanced packaging solutions.
+ 3 years of experience delivering research and development (R&D) concepts to a released product.
+ 3 years of experience with one or more of the following technologies: 2.5D/3D integration, wafer-level packaging, panel-level packaging, or hybrid bonding.
**Preferred qualifications:**
+ Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related ...
_corporate_fare_ Google _place_ Goleta, CA, USA
**Mid**
Experience driving progress, solving problems, and mentoring more junior team members; deeper expertise and applied knowledge within relevant area.
**Minimum qualifications:**
+ Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
+ 3 years of experience developing advanced packaging solutions.
+ 3 years of experience delivering research and development (R&D) concepts to a released product.
+ 3 years of experience with one or more of the following technologies: 2.5D/3D integration, wafer-level packaging, panel-level packaging, or hybrid bonding.
**Preferred qualifications:**
+ Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related ...
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